BES2300-Z
Bluetooth Audio Platform with FWS*
Product Specification Rev 1.0
BES2300-Z Product Speci?caon
Datasheet Status
Status descripon.
Datasheet Status D
Product Status Development Quali
on
Revision Control Rev 0.01 - 0.49 Rev 0.50 - 0.99
Descripon
Datasheets contain pre-tapeout informaon from the objecve design speci
Preliminary
on and is only for internal use.
Datasheets contain informaon on post-tapeout and pre-volume producon products, and a revision of this document or supplementary informaon may be published at a later date. BESTECHNIC may make changes to these speci
Released
Producon
Rev1.xx
ons at any me without noce.
ons at any me
Datasheets contain informaon on volume producon products. BESTECHNIC may make changes to these speciwithout noce.
Revision History
Bars appearing in the margin (as shown here) indicate where technical changes have occurred for this revision. The following table lists the technical content changes for all revisions.
Revision 0.10 0.11 0.12 0.13 0.14 0.15 0.16 0.17 0.18 0.19 0.20 0.21 0.22 0.23 0.30 0.31 1.0
Date 01/20/2018 05/16/2018 05/16/2018 06/04/2018 06/06/2018 06/06/2018 07/09/2018 07/10/2018 07/12/2018 08/10/2018 29/10/2018 02/11/2018 05/11/2018 27/11/2018 30/11/2018 24/12/2018 30/12/2018
Descripon
Inial de?nion Update ball Map Update ball Map & Pin descripon Modify parameter Update Spec
Modify a type error Update Format Modify pin list Update ball map Modify parameter Modify parameter Modify parameter
Modify support Audio bit to 24bit Update spec
Update Spec parameter Update Spec
Update Spec, Modify type error
BES2300-Z Product Speci?cation
Table of contents
Datasheet Status ................................................................................................................................................................... 2 Revision History .................................................................................................................................................................... 2 List of Tables and ?gures ...................................................................................................................................................... 5 1
General Description ...................................................................................................................................................... 8 1.1 Applications ............................................................................................................................................................ 8 1.2 Features .................................................................................................................................................................. 9 2
Platform Feature ......................................................................................................................................................... 10 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 2.10 2.11
MCU Subsystem ............................................................................................................................................ 10 ARM Cortex-M4F Processor Core .................................................................................................................. 11 Memory ......................................................................................................................................................... 13 Interrupt ........................................................................................................................................................ 16 DMA ............................................................................................................................................................... 16 Timers ............................................................................................................................................................ 16 HWI2C ............................................................................................................................................................ 16 CMU ............................................................................................................................................................... 16 System Peripherals ........................................................................................................................................ 16 Power Control and Regulation ...................................................................................................................... 29 Audio Interface .............................................................................................................................................. 32
2.12 CLOCK GENERATION ...................................................................................................................................... 36 3
Bluetooth Modem Description ................................................................................................................................... 37 3.1 3.2 3.3 4
Bluetooth RF Transceiver architecture .......................................................................................................... 37 Bluetooth phy Architecture ........................................................................................................................... 38 Bluetooth Mac architecture ........................................................................................................................... 40
Electrical Characteristics ............................................................................................................................................. 42 4.1 Electrical Characteristics ...................................................................................................................................... 42 4.2 Bluetooth Radio Electrical Characteristics........................................................................................................... 43 4.3 Audio Codec Electrical Characteristics ................................................................................................................. 47 4.4 BUCK Electrical Characteristics ............................................................................................................................ 48 4.5 ESD Protection ...................................................................................................................................................... 49
5 Pin Map & Application Schematic ............................................................................................................................... 50 5.1 Pin Description ..................................................................................................................................................... 50
BES2300-Z Product Specification
5.2 Application Schematic .......................................................................................................................................... 53 6
Package Dimensions ................................................................................................................................................... 54 6.1 BGA Dimensions ................................................................................................................................................... 54 7
SMT Caution ................................................................................................................................................................ 55 7.1 Land Pad and Stencil Design ................................................................................................................................ 55 7.2 Solder Reflow Profile ........................................................................................................................................... 55 7.3 RoHS Compliant .................................................................................................................................................... 56 7.4 ESD Sensitivity ...................................................................................................................................................... 56 7.5 Storage Alert......................................................................................................................................................... 56 8 9
Ordering Information .................................................................................................................................................. 58 Tape and Reel Information ......................................................................................................................................... 59 9.1 Tape Orientation .................................................................................................................................................. 59 9.2 Reel Dimensions ................................................................................................................................................... 59 9.3 Tape Dimensions .................................................................................................................................................. 60 9.4 Moisture Sensitivity Level .................................................................................................................................... 60
BES2300-Z Product Specification
List of Tables and figures
Table 2-1 System Address Map Table ......................................................................................................................... 13 Table 2-2 AHB1 Address Map Table ............................................................................................................................ 14 Table 2-3 APB0 Address Map Table ............................................................................................................................ 15 Table 2-4 AON Address Map Table ............................................................................................................................. 15 Table 2-5 Receive FIFO bit functions ........................................................................................................................... 20 Table 2-6 Burst threshold of receive and transmit FIFO ........................................................................................... 21 Table 2-7 Some of CLKSRC register bits ..................................................................................................................... 27 Table 4-1 DC Electrical Specification (a) ....................................................................................................................... 42 Table 4-2 DC Electrical Specification (c) ....................................................................................................................... 42 Table 4-3 Power Consumption (a) ................................................................................................................................ 42 Table 4-4 Receiver Characteristics - Basic Data Rate (a) .............................................................................................. 43 Table 4-5 Transmitter Characteristics - Basic Data Rate (a) ......................................................................................... 43 Table 4-6 Receiver Characteristics - Enhanced Data Rate (a) ....................................................................................... 44 Table 4-7 Transmitter Characteristics - Enhanced Data Rate (a) .................................................................................. 45 Table 4-8 Bluetooth LE Receiver Specifications .......................................................................................................... 46 Table 4-9 Bluetooth LE Transmitter Specifications ..................................................................................................... 46 Table 4-10 near field Bluetooth transceiver characteristics (b) .................................................................................... 47 Table 4-9 Digital to Analogue Converter under 1.95V (b) ............................................................................................ 47 Table 5-1 BES2300-Z Pins Description ........................................................................................................................ 50 Table 7-1 Package peak reflow temperature - Sn/Pb ................................................................................................. 55 Table 7-2 Package peak reflow temperature - Pb-Free (a)........................................................................................... 55 Table 7-3 Solder Reflow Profile Feature ..................................................................................................................... 56
Figure 1-1 BES2300-Z Top View .................................................................................................................................... 8
BES2300
