MANUFACTURING METHOD FOR PHOTOSENSOR
申请(专利)号： JP19990323266
专利号： JP2001144308A 主分类号： H01L31/02
申请日： 1999-11-12 公开公告日： 2001-05-25
分类号： H01L31/02;
H01L23/14; H01L23/48; H01L27/14 发明设计人： ANDO YOSHIYUKI;
ASANO HIDEKI 申请国代码： JP
优先权： 19991112 JP
32326699
摘 要 附 图：
申请权利人： HITACHI CABLE
LTD 公开国代码： JP 优先权国家： JP
摘 要：
PROBLEM TO BE SOLVED: To form a desired two-dimensional circuit with less labor, with good yield, on the surface of an insulating sheet at a lower cost for forming a substrate, in a manufacturing method for photosensor, where a photosensor element is mounted in a recessed part with an insulating sheet comprising a plurality of recessed parts as a substrate. SOLUTION: A conductive sheet is stacked on at least one surface of insulating sheet, such as a prepreg of glass nonwoven fabric, etc., for compression- molding, to form a
composite sheet comprising a recessed part. A circuit of required pattern is
formed on its surface, with a photosensor element mounted on the bottom of the recessed pat, being connected to the circuit. 主权项：
【請求項1】 ガラス不織布に樹脂組成物を含浸させたプリプレグ等の圧縮成形可能
な絶縁シートを準備し、
前記絶縁シートの少なくとも一面に金属層を積層して圧縮成形することによってホトセンサ素子を搭載するた
权 利 要 求 说 明 书
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MANUFACTURING METHOD FOR PHOTOSENSOR
